Nxp.to

BYC8X-600P
Hyperfast power diode
3 January 2014
Product data sheet
1. General description
Hyperfast power diode in a SOD113 (2-lead TO-220F) plastic package.
2. Features and benefits
• Reduces switching losses in associated MOSFET 3. Applications
• Continuous Current Mode (CCM) Power Factor Correction (PFC) • Half-bridge/full-bridge switched-mode power supplies 4. Quick reference data
Quick reference data
Parameter
Conditions
Static characteristics
VF
Dynamic characteristics
trr
NXP Semiconductors
BYC8X-600P
Hyperfast power diode
5. Pinning information
Pinning information
Symbol Description
Simplified outline
Graphic symbol
TO-220F (SOD113)
6. Ordering information
Ordering information
Type number
Package
Name

Description
plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 2-lead TO-220 "full pack" 7. Marking
Marking codes
Type number
Marking code
8. Limiting values
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Parameter
Conditions
repetitive peak forward current δ = 0.5 ; tp = 25 µs; Th ≤ 75 °C; square- All information provided in this document is subject to legal disclaimers.
Product data sheet
3 January 2014
NXP Semiconductors
BYC8X-600P
Hyperfast power diode
Parameter
Conditions
tp = 8.3 ms; Tj(init) = 25 °C; sine-wave Fig. 1. Forward power dissipation as a function of
Fig. 2. Forward power dissipation as a function of
average forward current; square waveform;
average forward current; sinusoidal waveform;
maximum values
maximum values
Fig. 3. Average forward current as a function of
Fig. 4. Non-repetitive peak forward current as a
heatsink temperature; maximum values
function of pulse width; square waveform;
maximum values
All information provided in this document is subject to legal disclaimers.
Product data sheet
3 January 2014
NXP Semiconductors
BYC8X-600P
Hyperfast power diode
9. Thermal characteristics
Thermal characteristics
Parameter
Conditions
Fig. 5. Transient thermal impedance from junction to heatsink as a function of pulse width
10. Isolation characteristics
Isolation characteristics
Parameter
Conditions
RMS isolation voltage 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %; from all pins to external heatsink; sinusoidalwaveform; clean and dust free 11. Characteristics
Characteristics
Parameter
Conditions
Static characteristics
VF
All information provided in this document is subject to legal disclaimers.
Product data sheet
3 January 2014
NXP Semiconductors
BYC8X-600P
Hyperfast power diode
Parameter
Conditions
Dynamic characteristics
Qr
IF = 8 A; VR = 200 V; dIF/dt = 200 A/µs; Tj = 25 °C; IF = 8 A; VR = 200 V; dIF/dt = 200 A/µs; Tj = 25 °C; IF = 8 A; VR = 400 V; dIF/dt = 500 A/µs; peak reverse recovery IF = 8 A; VR = 200 V; dIF/dt = 200 A/µs; Tj = 25 °C; IF = 8 A; VR = 200 V; dIF/dt = 200 A/µs; Fig. 7. Reverse recovery definitions; ramp recovery
Fig. 6. Forward current as a function of forward
All information provided in this document is subject to legal disclaimers.
Product data sheet
3 January 2014
NXP Semiconductors
BYC8X-600P
Hyperfast power diode
12. Package outline
Plastic single-ended package; isolated heatsink mounted;
1 mounting hole; 2-lead TO-220 'full pack'
DIMENSIONS (mm are the original dimensions)
L1(1) max m
1. Terminals are uncontrol ed within zone L1.
REFERENCES
EUROPEAN
PROJECTION
ISSUE DATE
Fig. 8. Package outline TO-220F (SOD113)
All information provided in this document is subject to legal disclaimers.
Product data sheet
3 January 2014
NXP Semiconductors
BYC8X-600P
Hyperfast power diode
In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - 13. Legal information
lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of 13.1 Data sheet status
Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards Document
Definition
customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
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product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
13.2 Definitions
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specified use without further testing or modification.
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Product specification — The information and data provided in a Product
Limiting values — Stress above one or more limiting values (as defined in
data sheet shall define the specification of the product as agreed between the Absolute Maximum Ratings System of IEC 60134) will cause permanent NXP Semiconductors and its customer, unless NXP Semiconductors and damage to the device. Limiting values are stress ratings only and (proper) customer have explicitly agreed otherwise in writing. In no event however, operation of the device at these or any other conditions above those shall an agreement be valid in which the NXP Semiconductors product given in the Recommended operating conditions section (if present) or the is deemed to offer functions and qualities beyond those described in the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.
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or construed as an offer to sell products that is open for acceptance or the All information provided in this document is subject to legal disclaimers.
Product data sheet
3 January 2014
NXP Semiconductors
BYC8X-600P
Hyperfast power diode
grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
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NXP Semiconductors accepts no liability for inclusion and/or use of non- automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
All information provided in this document is subject to legal disclaimers.
Product data sheet
3 January 2014
NXP Semiconductors
BYC8X-600P
Hyperfast power diode
14. Contents
1

NXP N.V. 2014. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected] Date of release: 3 January 2014
All information provided in this document is subject to legal disclaimers.
Product data sheet
3 January 2014

Source: http://nxp.to/documents/data_sheet/BYC8X-600P.pdf

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